View L-T670LGCT_7700525.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

para light electronics co., ltd. 4f, no.1, lane 93, chien yi road, chung ho city, taipei, taiwan tel: 886-2-2225-3733 fax: 886-2-2225-4800 e-mail: para@para.com.tw http://www.para.com.tw data sheet part no.: L-T670LGCT rev: a / 5 customers approval : _______________ dcc : ____________ drawing no. : ds-7a-07-0005 date : 2009-10-31 page 1 of 15 para-for-065
surface mount device led part no. : L-T670LGCT rev: a / 5 features top view, wide view angle, pure green color plcc 2 package smd led . eia std package, packing in 8mm tape on 7" diameter reels (ansi/eia-481-b-2001). compatible with automatic pick & place equipment. compatible with ir reflow soldering and ttw solderi ng. pb free product and acceptable lead-free process. meet rohs green product. application backlighting (switches, keys, displays, illuminated advertising) emergency lighting / signal and symbol luminaries. package outline dimensions 3.20 0.75 top view side view back view 1.90 front view - polarity + c 0.80 0.15 0.75 0.80 3.50 2.80 2.40 2.70 2.18 notes: 1. all dimensions are in millimeters. 2. tolerance is 0.10mm (.004") unless otherwise noted. drawing no. : ds-7a-07-0005 date : 2009-10-31 page 2 of 15 para-for-068
surface mount device led part no. : L-T670LGCT rev: a / 5 chip materials dice material : ingan light color : pure green lens color : water clear absolute maximum ratings(ta=25 ) symbol parameter rating unit p d power dissipation 75 mw i pf peak forward current (1/10 duty cycle, 0.1ms pulse width) 100 ma i f continuous forward current 20 ma v r reverse voltage 5 v esd electrostatic discharge threshold(hbm) note a 1000 v topr operating temperature range -40 ~ + 85 tstg storage temperature range -40 ~ + 85 reflow soldering:260 (for 10seconds) tsld soldering temperature (one times max.) hand soldering:350 (for 3 seconds) note a : hbm : human body model. seller gives no other assur ances regarding the ability of to withstand esd. electro-optical characteristics (ta=25 ) parameter symbol min. typ. max. unit test condition luminous intensity iv 650 1000 mcd if=20ma viewing angle 2 1/2 120 deg peak emission wavelength p 520 nm measurement @peak dominant wavelength d 525 nm if=20ma forward voltage vf 3.0 3.50 v if = 20ma spectrum radiation bandwidth ? 25 nm if=20ma reverse current ir 10 a vr = 5v drawing no. : ds-7a-07-0005 date : 2009-10-31 page 3 of 15 para-for-068
surface mount device led part no. : L-T670LGCT rev: a / 5 notes: 1. luminous intensity is measured with a light sensor and filter combination that proximities the cie eye-response curve. 2. 1/2 is the off-axis angle at which the luminous intens ity is half the axial luminous intensity. 3. caution in esd : static electricity and surge damages the led. it is recommended use a wrist band or anti-electrostatic glove when handling the led. all devices, equipment and machinery must be properly grounded. 4. major standard testing equipment by instrument sys tem model : cas140b compact array spectrometer and keithley source meter mode l : 2400. typical electro-optical characteristics curves fig.1 relative intensity vs. wavelength drawing no. : ds-7a-07-0005 date : 2009-10-31 page 4 of 15 para-for-068
surface mount device led part no. : L-T670LGCT rev: a / 5 typical electro-optical characteristics curves (25 ambient temperature unless otherwise noted) relative luminous intensity(%) 0.7 0.1 0.5 0.3 0.4 0.2 0.6 90 80 fig.4 luminous intensity vs.ambient temperature ambient temperature ta( ) 20 1.0 0.8 0.9 - 4 0 -60 1 -20 -0 70 60 50 40 30 0 10 20 4 0 60 100 80 fig.5 forward current derating curve ambient temperature ta( ) 0 0 20 40 80 60 100 fig.2 luminous intensity vs.forward current luminous lntensity(mcd) fig.1 forward current vs.forward voltage 10 100 1000 forward current if(ma) 10 20 30 40 50 fig. 3 relative luminous intensity vs.forward current relative luminous lntensity normalized of 20ma fig.6 relative intensity vs.angle drawing no. : ds-7a-07-0005 date : 2009-10-31 page 5 of 15 para-for-068
surface mount device led part no. : L-T670LGCT rev: a / 5 bin code list luminous intensity(iv), unit:mcd@20ma forward volta ge(vf), unit:v@20ma bin code min max bin code min max p20 650 800 14 2.9 3.0 p21 800 1000 15 3.0 3.1 p22 1000 1250 16 3.1 3.2 p23 1250 1550 17 3.2 3.3 18 3.3 3.4 19 3.4 3.5 tolerance of each bin are 1 0 % tolerance of each bin are 0.1volt dominant wavelength (hue),unit: nm@20ma bin code min max ap 520 525 aq 525 530 tolerance of each bin are 1nm drawing no. : ds-7a-07-0005 date : 2009-10-31 page 6 of 15 para-for-068
surface mount device led part no. : L-T670LGCT rev: a / 5 label explanation cus. part no: to be denominated. customer: to be denominated. part no: refer to p15 p22--- luminous intensity code 15--- forward voltage code aq--- dominant wavelength lot no: e l s 7 8 0001 a---e: for series number b---l: local f: foreign c---s: plcc smd d---year e---month f---spec. packing quantity of bag : 2000pcs for t670 series 2000pcs for t650 series 2000pcs for s020 series date code 2007 08 29 g h i g--- year h--- month i --- day drawing no. : ds-7a-07-0005 date : 2009-10-31 page 7 of 15 para-for-068 a b c d e f
surface mount device led part no. : L-T670LGCT rev: a / 5 reel dimensions notes: 1. taping quantity : 2000pcs 2. the tolerances unless noted is 0.1mm, angle 0.5 , unit: mm. suggest soldering pad dimensions 2.2 1.8 1.6 drawing no. : ds-7a-07-0005 date : 2009-10-31 page 8 of 15 para-for-068
surface mount device led part no. : L-T670LGCT rev: a / 5 package dimensions of tape and reel * 8 .00+0.30 -0.10 ( ) 5 *3.66.10 (.144.004) *2.03+0.10 (.080+.004) 3.500.05 (.138.002) 1.750.10 (.069.004) 2.000.05 (.079.002) 4.000.10 (.157.004) 4.000.10 (.157.004) *0.23 0.03 (.009 .001) -.004 0.315+.012 notes: all dimensions are in millimeters. packaging of electronic components on continuous ta pes drawing no. : ds-7a-07-0005 date : 2009-10-31 page 9 of 15 para-for-068
surface mount device led part no. : L-T670LGCT rev: a / 5 moisture resistant packaging label aluminum moistue-proof bag desiccant label h:\smd\smd\smd \ ? ? .jpg h:\smd\smd\smd \ ? ? .jpg h : \ s m d \ s m d \ s m d \ ? ? . j p g h : \ s m d \ s m d \ s m d \ ? ? . j p g 2 5 5 435 145 2 4 0 2 1 0 label box carton reel notes : one reel in a bag, one bag in a inner box, ten inner boxes in a carton. unit : mm. cleaning if cleaning is required , use the following solutio ns for less than 1 minute and less than 40 . appropriate chemicals: isopropyl alcohol. (when usi ng other solvents, it should be confirmed beforehand whether the solvents will dissolve the p ackage and the resin or not.) effect of ultrasonic cleaning on the led resin body differs depending on such factors as ultrasonic power and the assembled condition. befor e cleaning, a pre-test should be confirm whether any damage to the leds will occur. drawing no. : ds-7a-07-0005 date : 2009-10-31 page 10of 15 para-for-068
surface mount device led part no. : L-T670LGCT rev: a / 5 suggest sn/pb ir reflow soldering profile condition : suggest pb-free ir reflow soldering profile conditi on: drawing no. : ds-7a-07-0005 date : 2009-10-31 page 11 of 15 para-for-068
surface mount device led part no. : L-T670LGCT rev: a / 5 cautions 1. static electricity: * static electricity or surge voltage damages the l eds. it is recommended that a wrist band or an anti-elec trostatic glove be used when handling the leds. * all devices, equipment and machinery must be prop erly grounded. it is recommended that measures be taken against su rge voltage to the equipment that mounts the leds. * when inspecting the final products in which leds were assembled, it is recommended to check whether the assembled leds are damaged by static el ectricity or not. it is easy to find static-damaged leds by a light-on test or a vf test at a lower cur rent (blew 1ma is recommended). * damaged leds will show some unusual characteristi cs such as the leak current remarkably increases, the forward voltage becomes lower, or the leds do n ot light at the low current. criteria: (vf>2.0v,at if=0.5m a ) 2. storage : * before opening the package : the leds should be kept at 30c or less and 85%rh or less. when storing the leds, moisture proof packaging with absorbent material (silica gel ) is recommended. * after opening the package : the leds should be kept at 30c or less and 70%rh or less. the leds should be sold ered within 168 hours (7 days) after opening the package. if un used leds remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). it is also recommended to return the leds to the original moisture poof bag and to reseal the moisture proof bag again. if the moisture absorbent material (silica gel) has faded away or the leds have exceeded the storage time, baking treatment should e performed u sing the following conditions. baking treatment: more than 24hours at 65 5 . * please avoid rapid transitions in ambient tempera ture in high humidity environments where condensation may occur. 3. soldering: do not apply any stress to the led lens during sold ering while the led is at high temperature. recommended soldering condition. * reflow soldering : pre-heat 120~150c, 120sec. max., peak temperature : 240c max. soldering time : 10 sec max. * soldering iron : (not recommended) temperature350c max., soldering time : 3 sec. max. (one time only), power dissipation of iron : 20w max. use sn60 solder of solder with silver cont ent and dont to touch led lens when soldering. drawing no. : ds-7a-07-0005 date : 2009-10-31 page 12 of 15 para-for-068
surface mount device led part no. : L-T670LGCT rev: a / 5 4. lead-free soldering for reflow soldering : 1 pre-heat temp: 150-180 ,120sec.max. 2 soldering temp: temperature of soldering pot over 2 40 ,40sec.max. 3 peak temperature: 260 10sec. 4 reflow repetition: 2 times max. 5 suggest solder paste formula : 93.3 sn/3.1 ag/3.1 b i/0.5 cu for soldering iron (not recommended) : 1 iron tip temp: 350 max. 2 soldering iron: 30w max. 3 soldering time: 3 sec. max. one time. 5. drive method circuit model a circuit model b (a)recommended circuit. (b)the difference of brightness between led`s could be found due to the vf-if characteristics of led. 6. reliability 1 criteria for judging the damage criteria for judgement item symbol test conditions min. max. forward voltage vf if=20ma - u.s.l.*) 1.1 reverse current ir vr=5v - u.s.l.*) 2.0 luminous intensity iv if=20ma l.s.l**) 0.7 - *) u.s.l.: upper standard level **) l.s.l: lower standard level drawing no. : ds-7a-07-0005 date : 2009-10-31 page 13 of 15 para-for-068
surface mount device led part no. : L-T670LGCT rev: a / 5 2 test items and results test item reference standard test condition note number of damaged resistance to soldering heat (reflow soldering) jeita ed-4701300 301 tsld=260 ,10sec. (pre treatment 30 ,70%,168hrs) 2times 0/50 solder ability (reflow soldering) jeita ed-4701300 303 tsld=215 ,3sec. (lead solder) 1time over 95% 0/50 thermal shock jeita ed-4701300 307 -40 ~ 100 30min. 30min. 100cycles 0/50 temperature cycle jeita ed-4701100 105 -40 ~ 25 ~100 ~25 30min. 5min. 30min. 5min 100cycles 0/50 high temperature storage jeita ed-4701200- 201 ta=100 1000hrs. 0/50 temperature humidity storage jeita ed-4701100 103 ta=60 ,rh=90% 1000hrs. 0/50 low temperature storage jeita ed-4701200 202 ta=-40 1000hrs. 0/50 steady state operating life condition ta=25 ,if=20ma 1000hrs. 0/50 steady state operating life of high temperature ta=85 ,if=5ma 500hrs. 0/50 steady state operating life of high humidity heat ta=60 ,rh=90%,if=15ma 500hrs. 0/50 steady state operating life of low temperature ta=-30 ,if=20ma 500hrs. 0/50 vibration jeita ed-4701400 403 100~2000~100hzsweep 4min.200m/s 2 3direction,4cycles 48min 0/50 substrate bending jeita ed-4702 3mm,5 1sec 1time 0/50 stick jeita ed-4702 5n,10 1sec 1time 0/50 7.others: the appearance and specifications of the product ma y be modified for improvement without notice. drawing no. : ds-7a-07-0005 date : 2009-10-31 page 14 of 15 para-for-068
surface mount device led part no. : L-T670LGCT rev: a / 5 part no. system : l C t 67 0 x x t - x x x x drawing no. : ds-7a-07-0005 date : 2009-10-31 page 15 of 15 para-for-068 xxxx : special specification for customer t : taping for 7 inch reel tc : taping for 13 inch reel lens color c : water clear w : white diffused t : color transparent d : color diffused ky : 9mil alingap 590nm super yellow kr : 9mil alingap 630 nm super red te : 14mil alingap 624 nm super red ty: 14mil alingap590 nm super yellow lb : ingan ito rough 470nm blue lg : ingan itorough520nm green w : ingan + yag white color 0 : single chip 1/2 : super thin single chip 5/6 : dual chip f : three chip(full color) 650 : 3020 1.3t type 670 : 3528 1.9t type 020 : 3812 0.6t type c : pcb top view type t :plcc top view type s : side view type

▲Up To Search▲

Price & Availability of L-T670LGCT

	To Download L-T670LGCT Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .